Show simple item record

dc.contributor.advisorDavid E. Hardt.en_US
dc.contributor.authorSingh, Abhishek, M. Eng. Massachusetts Institute of Technologyen_US
dc.contributor.otherMassachusetts Institute of Technology. Department of Mechanical Engineering.en_US
dc.date.accessioned2017-02-22T19:02:35Z
dc.date.available2017-02-22T19:02:35Z
dc.date.copyright2016en_US
dc.date.issued2016en_US
dc.identifier.urihttp://hdl.handle.net/1721.1/107079
dc.descriptionThesis: M. Eng. in Advanced Manufacturing and Design, Massachusetts Institute of Technology, Department of Mechanical Engineering, 2016.en_US
dc.descriptionCataloged from PDF version of thesis.en_US
dc.descriptionIncludes bibliographical references (pages 98-99).en_US
dc.description.abstractHighly Accelerated Life Testing (HALT) is a test methodology to evaluate the reliability of electronic and electromechanical devices. This thesis aimed at the implementation of Highly Accelerated Life Testing (HALT) on Printed Circuit Boards. A standard operating procedure for implementing Highly Accelerated Life Testing (HALT) to increase the reliability of PCBs used in various Waters equipment is developed and validated. For the creation of the standard operating procedure a very reliable Alliance PCB is selected that acts as a benchmark for screening other boards. Extensive testing is done on the Alliance PCB by subjecting it to thermal and vibration stresses through a Hot Step Stress profile, Cold Step Stress profile, Thermal Cycling, Vibration Step Stress profile and Combined Cycle profile. For validation, the standard operating procedure created is applied to a less reliable Acquity board to check whether the same standard operating procedure is effective in precipitating and detecting failures on a variety of different boards that Waters equipment uses. As expected the operating limits of temperature and vibration of the Acquity board are found to be less than the Alliance board i.e. the Acquity experiences failure much earlier than Alliance when subjected to the same stress profiles. This result is in direct correlation with the on field failure data obtained for these two boards - the less reliable board has lesser operating limits.en_US
dc.description.statementofresponsibilityby Abhishek Singh.en_US
dc.format.extent99 pagesen_US
dc.language.isoengen_US
dc.publisherMassachusetts Institute of Technologyen_US
dc.rightsMIT theses are protected by copyright. They may be viewed, downloaded, or printed from this source but further reproduction or distribution in any format is prohibited without written permission.en_US
dc.rights.urihttp://dspace.mit.edu/handle/1721.1/7582en_US
dc.subjectMechanical Engineering.en_US
dc.titleCreation, validation, and implementation of a Highly Accelerated Life Testing (HALT) procedure to improve the reliability of printed circuit boardsen_US
dc.title.alternativeCreation, validation, and implementation of a HALT procedure to improve the reliability of PCBsen_US
dc.typeThesisen_US
dc.description.degreeM. Eng. in Advanced Manufacturing and Designen_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Mechanical Engineering
dc.identifier.oclc971136533en_US


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record