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dc.contributor.advisorDavid L Trumper and Jeffrey H Lang.en_US
dc.contributor.authorHamer, Tyler Thomas.en_US
dc.contributor.otherMassachusetts Institute of Technology. Department of Mechanical Engineering.en_US
dc.date.accessioned2017-05-11T19:55:47Z
dc.date.available2017-05-11T19:55:47Z
dc.date.copyright2017en_US
dc.date.issued2017en_US
dc.identifier.urihttp://hdl.handle.net/1721.1/108921en_US
dc.descriptionThis electronic version was submitted by the student author. The certified thesis is available in the Institute Archives and Special Collections.en_US
dc.descriptionThesis: S.M., Massachusetts Institute of Technology, Department of Mechanical Engineering, 2017en_US
dc.descriptionCataloged from PDF version of thesis.en_US
dc.descriptionIncludes bibliographical references (pages 147-151).en_US
dc.description.abstractSpot defects are a leading source of failure in the fabrication of integrated circuits (ICs). Thus, the IC industry inspects for defects at multiple stages of IC fabrication, especially the fabrication of IC photomasks. However, existing non-invasive imaging methods cannot image a modern photomask in a reasonable time-frame. Electroquasistatic (EQS) sensors are arrays of electrode pairs that capacitively couple to targets they sweep over. Utilizing high measurement frequencies and a number of parallel scanning electrode pairs, EQS sensors have been suggested as a potential high speed alternative for defect detection in IC fabrication. This thesis continues the investigation into EQS sensors for high speed imaging by exploring EQS sensors driven with high excitation frequencies. We develop electrode arrays that can be driven with high excitation frequencies and construct high frequency EQS sensors by attaching them to high frequency drive electronics. We also fabricate a test fixture for positioning these sensors relative to and sweeping them across targets on a conductive base. As the sensors sweep across targets, their impedance is measured from 1 - 500 MHz using an impedance analyzer and is later converted into the capacitance between the sensor's electrode array and the target. Capacitance changes are produced by a variable air gap and by a dielectric step, confirming these sensors can detect changes in a target's geometric and material properties with high excitation frequencies. Finally, we present concepts for a high speed measurement system which utilizes these sensors.en_US
dc.description.statementofresponsibilityby Tyler Thomas Hamer.en_US
dc.format.extent172 pagesen_US
dc.language.isoengen_US
dc.publisherMassachusetts Institute of Technologyen_US
dc.rightsMIT theses are protected by copyright. They may be viewed, downloaded, or printed from this source but further reproduction or distribution in any format is prohibited without written permission.en_US
dc.rights.urihttp://dspace.mit.edu/handle/1721.1/7582en_US
dc.subjectMechanical Engineering.en_US
dc.titleElectrode arrays, test fixture, and system concept for high-bandwidth capacitive imagingen_US
dc.typeThesisen_US
dc.description.degreeS.M.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Mechanical Engineeringen_US
dc.identifier.oclc986241524en_US
dc.description.collectionS.M. Massachusetts Institute of Technology, Department of Mechanical Engineeringen_US
dspace.imported2019-07-12T19:26:59Zen_US


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