Tensor Computation: A New Framework for High-Dimensional Problems in EDA
Author(s)
Zhang, Zheng; Batselier, Kim; Liu, Haotian; Daniel, Luca; Wong, Ngai
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Many critical electronic design automation (EDA) problems suffer from the curse of dimensionality, i.e., the very fast-scaling computational burden produced by large number of parameters and/or unknown variables. This phenomenon may be caused by multiple spatial or temporal factors (e.g., 3-D field solvers discretizations and multirate circuit simulation), nonlinearity of devices and circuits, large number of design or optimization parameters (e.g., full-chip routing/placement and circuit sizing), or extensive process variations (e.g., variability /reliability analysis and design for manufacturability). The computational challenges generated by such high-dimensional problems are generally hard to handle efficiently with traditional EDA core algorithms that are based on matrix and vector computation. This paper presents “tensor computation” as an alternative general framework for the development of efficient EDA algorithms and tools. A tensor is a high-dimensional generalization of a matrix and a vector, and is a natural choice for both storing and solving efficiently high-dimensional EDA problems. This paper gives a basic tutorial on tensors, demonstrates some recent examples of EDA applications (e.g., nonlinear circuit modeling and high-dimensional uncertainty quantification), and suggests further open EDA problems where the use of tensor computation could be of advantage.
Date issued
2016-10Department
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer ScienceJournal
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Citation
Zhang, Zheng et al. “Tensor Computation: A New Framework for High-Dimensional Problems in EDA.” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems 36.4 (2017): 521–536.
Version: Author's final manuscript
ISSN
0278-0070
1937-4151