dc.contributor.advisor | Antoine Allanore. | en_US |
dc.contributor.author | Wagner, Mary Elizabeth, S.B. Massachusetts Institute of Technology | en_US |
dc.contributor.other | Massachusetts Institute of Technology. Department of Materials Science and Engineering. | en_US |
dc.date.accessioned | 2017-08-17T13:01:55Z | |
dc.date.available | 2017-08-17T13:01:55Z | |
dc.date.copyright | 2015 | en_US |
dc.date.issued | 2016 | en_US |
dc.identifier.uri | http://hdl.handle.net/1721.1/110960 | |
dc.description | Thesis: S.B., Massachusetts Institute of Technology, Department of Materials Science and Engineering, February 2016. | en_US |
dc.description | This electronic version was submitted by the student author. The certified thesis is available in the Institute Archives and Special Collections. | en_US |
dc.description | Cataloged from student-submitted PDF version of thesis. | en_US |
dc.description | Includes bibliographical references (pages 51-52). | en_US |
dc.description.abstract | The electrodeposition of copper metal in a concentrated sulfuric acid solution is reported to occur through a four-step mechanism: (I) the dehydration of Cu2+ (H2O)6, (II) the reduction of Cu2+ to cu+, (III) the dehydration cu+ (H2O)6-x, (IV) the reduction of Cu+ to copper metal. The dehydration steps have been found to be responsible for the pH-dependence of the electrodeposition reaction. It is also reported, although not well understood, that the presence of Fe2+ ions affects the reaction kinetics. In this work, the kinetics of copper electrodeposition were studied using alternating current cyclic voltammetry. The reaction was studied at a copper rotating disk electrode with varying concentrations of Cu2+ and Fe2+ . At sufficiently low pH, and a sufficiently high concentration of Fe2+ , the deposition kinetics may be slowed enough to separately observe the two electron transfer steps involved in copper reduction. It was found that Fe2+ ions affect the electrodeposition kinetic by slowing down reaction kinetics, particularly the second electron transfer reaction. | en_US |
dc.description.statementofresponsibility | by Mary Elizabeth Wagner. | en_US |
dc.format.extent | 55 pages | en_US |
dc.language.iso | eng | en_US |
dc.publisher | Massachusetts Institute of Technology | en_US |
dc.rights | MIT theses are protected by copyright. They may be viewed, downloaded, or printed from this source but further reproduction or distribution in any format is prohibited without written permission. | en_US |
dc.rights.uri | http://dspace.mit.edu/handle/1721.1/7582 | en_US |
dc.subject | Materials Science and Engineering. | en_US |
dc.title | Advanced electrochemical characterization of copper deposition | en_US |
dc.type | Thesis | en_US |
dc.description.degree | S.B. | en_US |
dc.contributor.department | Massachusetts Institute of Technology. Department of Materials Science and Engineering | |
dc.identifier.oclc | 994207164 | en_US |