A nonintrusive magnetically self-powered vibration sensor for automated condition monitoring of electromechanical machines
Author(s)
Zachar, Lt. Ryan; Cotta, Lt. William; Schantz, Christopher; Moon, Jinyeong; Lindahl, Peter; Donnal, John Sebastian; Leeb, Steven B; ... Show more Show less
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This paper presents a nonintrusive and electromagnetically self-powered embedded system with vibration sensor for condition monitoring of electromechanical machinery. This system can be installed inside the terminal block of a motor or generator and supports wireless communication for transferring data to a mobile device or computer for subsequent performance analysis. As an initial application, the sensor package is configured for automated condition monitoring of resiliently mounted machines. Upon detecting a spin-down event, e.g. a motor turnoff, the system collects and transmits vibration and residual backemf data as the rotor decreases in rotational speed. This data is then processed to generate an empirical vibrational transfer function (eVTF) rich in condition information for detecting and differentiating machinery and vibrational mount pathologies. The utility of this system is demonstrated via lab-based tests of a resiliently mounted 1.1 kW three-phase induction motor, with results showcasing the usefulness of the embedded system for condition monitoring.
Date issued
2016-10Department
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science; Massachusetts Institute of Technology. Department of Mechanical Engineering; Massachusetts Institute of Technology. Research Laboratory of ElectronicsJournal
2016 IEEE AUTOTESTCON
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Citation
Moon, Jinyeong et al. “A Nonintrusive Magnetically Self-Powered Vibration Sensor for Automated Condition Monitoring of Electromechanical Machines.” 2016 IEEE AUTOTESTCON, September 12-15 2016, Anaheim, California, USA, Institute of Electrical and Electronics Engineers (IEEE), October 2016 © 2016 Institute of Electrical and Electronics Engineers (IEEE)
Version: Author's final manuscript
ISBN
978-1-5090-0790-5
ISSN
1558-4550