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dc.contributor.advisorEvelyn N. Wang.en_US
dc.contributor.authorSircar, Jay Den_US
dc.contributor.otherMassachusetts Institute of Technology. Department of Mechanical Engineering.en_US
dc.date.accessioned2017-10-18T15:10:32Z
dc.date.available2017-10-18T15:10:32Z
dc.date.copyright2017en_US
dc.date.issued2017en_US
dc.identifier.urihttp://hdl.handle.net/1721.1/111931
dc.descriptionThesis: S.M., Massachusetts Institute of Technology, Department of Mechanical Engineering, 2017.en_US
dc.descriptionCataloged from PDF version of thesis.en_US
dc.descriptionIncludes bibliographical references (pages 60-63).en_US
dc.description.abstractWe investigated the experimental performance of a nanoporous membrane for ultra-high heat flux dissipation from high performance integrated circuits. The biporous evaporation device utilizes thermally-connected, mechanically-supported, high capillarity membranes that maximize thin film evaporation and high permeability liquid supply channels that allow for lower viscous pressure losses. The 600 nm thick membrane was fabricated on a silicon on insulator (SOI) wafer, fusion-bonded to a separate wafer with larger liquid channels. Spreading effects and overall device performance arising from non-uniform heating and evaporation of methanol was captured experimentally. Heat fluxes up to 412 W/cm2, over an area of O.4x 5 mm, and with a temperature rise of 24.1 K from the heated substrate to ambient vapor, were obtained. These results are in good agreement with a high-fidelity, coupled fluid convection and solid conduction compact model, which was necessitated by computational feasibility, which incorporates non-equilibrium and sub-continuum effects at the liquid-vapor interface. This work provides a proof-of-concept demonstration of our biporous evaporation device. Simulations from the validated model, at optimized operating conditions and with improved working fluids, predict heat dissipation in excess of 1 kW/cm2 with a device temperature rise below 30 K, for this scalable cooling approach.en_US
dc.description.statementofresponsibilityby Jay D. Sircar.en_US
dc.format.extentvi, 63 pagesen_US
dc.language.isoengen_US
dc.publisherMassachusetts Institute of Technologyen_US
dc.rightsMIT theses are protected by copyright. They may be viewed, downloaded, or printed from this source but further reproduction or distribution in any format is prohibited without written permission.en_US
dc.rights.urihttp://dspace.mit.edu/handle/1721.1/7582en_US
dc.subjectMechanical Engineering.en_US
dc.titleFabrication of a nanoporous membrane device for high heat flux evaporative coolingen_US
dc.typeThesisen_US
dc.description.degreeS.M.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Mechanical Engineering.en_US
dc.identifier.oclc1005738566en_US


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