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Analysis of the thermal conductivity of epoxy and reaction bonded silicon nitride matrix particulate composites

dc.contributor.advisorYet-Ming Chiang, John Haggerty.en_US
dc.contributor.authorStephens, Clifforden_US
dc.date.accessioned2005-08-18T12:00:00Zen_US
dc.date.available2005-08-18T12:00:00Zen_US
dc.date.copyright1996en_US
dc.date.issued1996en_US
dc.identifier.urihttp://hdl.handle.net/1721.1/11239
dc.descriptionThesis (B.S.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1996.en_US
dc.descriptionIncludes bibliographical references (leaves 39-40).en_US
dc.description.statementofresponsibilityby Clifford Stephens.en_US
dc.format.extent40 leavesen_US
dc.format.extent2626836 bytes
dc.format.extent2626594 bytes
dc.format.mimetypeapplication/pdf
dc.format.mimetypeapplication/pdf
dc.language.isoengen_US
dc.publisherMassachusetts Institute of Technologyen_US
dc.rightsM.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.en_US
dc.rights.urihttp://dspace.mit.edu/handle/1721.1/7582
dc.subjectMaterials Science and Engineeringen_US
dc.titleAnalysis of the thermal conductivity of epoxy and reaction bonded silicon nitride matrix particulate compositesen_US
dc.typeThesisen_US
dc.description.degreeB.S.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Materials Science and Engineering
dc.identifier.oclc34791214en_US


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