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dc.contributor.authorHuang, Ting Yun Sasha
dc.contributor.authorKalidindi, Arvind Rama
dc.contributor.authorSchuh, Christopher A
dc.date.accessioned2018-02-12T18:05:14Z
dc.date.available2018-09-02T05:00:05Z
dc.date.issued2017-11
dc.identifier.issn0022-2461
dc.identifier.issn1573-4803
dc.identifier.urihttp://hdl.handle.net/1721.1/113587
dc.description.abstractThe structural stability of nanocrystalline aluminum–manganese (Al-6.5 at.% Mn) alloys is studied in the temperature range of 200–400 °C. Transmission electron microscopy shows that grain growth in this alloy is subdued by the presence of Mn, such that 100 nm or finer grain sizes can be retained at 200 and 300 °C even after 1 month of annealing. In contrast, the principal mode of instability in the alloy is the precipitation of the equilibrium Al6Mn phase, which was observed to form at much shorter timescales and is present at 300 and 400 °C after just 30 min. Differential scanning calorimetry was used to study the kinetics of the Al6Mn reaction using Johnson–Mehl–Avrami–Kolmogorov analysis and construct a time–temperature–transformation (TTT) diagram for this process. It is found that this Al–Mn single-phase nanostructured alloy can be stable against forming the Al6Mn phase and against grain growth for several months below 200 °C and for short thermal excursions up to 300 °C.en_US
dc.description.sponsorshipUnited States. Army Research Office. Institute for Soldier Nanotechnologies (Contract W911NF-13-D-0001)en_US
dc.publisherSpringer USen_US
dc.relation.isversionofhttp://dx.doi.org/10.1007/s10853-017-1764-4en_US
dc.rightsCreative Commons Attribution-Noncommercial-Share Alikeen_US
dc.rights.urihttp://creativecommons.org/licenses/by-nc-sa/4.0/en_US
dc.sourceSpringer USen_US
dc.titleGrain growth and second-phase precipitation in nanocrystalline aluminum–manganese electrodepositsen_US
dc.typeArticleen_US
dc.identifier.citationHuang, Ting-Yun, Arvind R. Kalidindi, and Christopher A. Schuh. “Grain Growth and Second-Phase Precipitation in Nanocrystalline Aluminum–manganese Electrodeposits.” Journal of Materials Science 53, no. 5 (November 2, 2017): 3709–3719.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Materials Science and Engineeringen_US
dc.contributor.mitauthorHuang, Ting Yun Sasha
dc.contributor.mitauthorKalidindi, Arvind Rama
dc.contributor.mitauthorSchuh, Christopher A
dc.relation.journalJournal of Materials Scienceen_US
dc.eprint.versionAuthor's final manuscripten_US
dc.type.urihttp://purl.org/eprint/type/JournalArticleen_US
eprint.statushttp://purl.org/eprint/status/PeerRevieweden_US
dc.date.updated2017-12-12T06:21:53Z
dc.language.rfc3066en
dc.rights.holderSpringer Science+Business Media, LLC
dspace.orderedauthorsHuang, Ting-Yun; Kalidindi, Arvind R.; Schuh, Christopher A.en_US
dspace.embargo.termsNen
dc.identifier.orcidhttps://orcid.org/0000-0002-3981-0989
dc.identifier.orcidhttps://orcid.org/0000-0003-2854-650X
dc.identifier.orcidhttps://orcid.org/0000-0001-9856-2682
mit.licenseOPEN_ACCESS_POLICYen_US


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