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dc.contributor.advisorRuonan Han.en_US
dc.contributor.authorHu, Zhi, Ph. D. Massachusetts Institute of Technologyen_US
dc.contributor.otherMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Science.en_US
dc.date.accessioned2018-03-02T22:21:15Z
dc.date.available2018-03-02T22:21:15Z
dc.date.copyright2017en_US
dc.date.issued2017en_US
dc.identifier.urihttp://hdl.handle.net/1721.1/113973
dc.descriptionThesis: S.M., Massachusetts Institute of Technology, Department of Electrical Engineering and Computer Science, 2017.en_US
dc.descriptionCataloged from PDF version of thesis.en_US
dc.descriptionIncludes bibliographical references (pages 77-80).en_US
dc.description.abstractIn this thesis, two chip designs using the scalable array architecture are introduced. Firstly, we introduce a scalable architecture of coherent harmonic oscillator array for high-power and collimated radiation beam at mid-THz band. The array is 2D-coupled, and each element achieves these functions: (i) maximize oscillation at fundamental frequency fo= 2 50 GHz; (ii) synchronize phase of fo and its harmonics among elements; (iii) cancel near-field radiation of fo, 2fo and 3fo, and (iv) efficiently radiate at 4fo and combine power in free space. The resultant compact design fits into the optimal radiator pitch of [lambda]/2 (half wavelength) for side-lobe suppression and enables high density implementation of THz arrays. An array prototype of 42 coherent radiators, or 91 resonant antennas, at 1 THz is also presented using IHP S13G2 130-nm SiGe process. The chip occupies 1-mm 2 area and consumes 1.1 W of DC power. The measured total radiated power and effective isotropically-radiated power (EIRP) are 80 pW and 13 dBm, respectively. Secondly, we introduce a scalable architecture of coherent receiver array for beam-steerable imaging. The array is also 2D-coupled, and each element achieves theses functions: (i) maximize oscillation at fo=120 GHz; (ii) synchronize phase of fo and its harmonics among elements; (iii) cancel radiation of fo and 2fo; and (iv) receive and down-convert RF signal near 2fo=240 GHz and output baseband signal for digital beam-forming. Chip is fabricated using TSMC 65nm LP CMOS technology.en_US
dc.description.statementofresponsibilityby Zhi Hu.en_US
dc.format.extent80 pagesen_US
dc.language.isoengen_US
dc.publisherMassachusetts Institute of Technologyen_US
dc.rightsMIT theses are protected by copyright. They may be viewed, downloaded, or printed from this source but further reproduction or distribution in any format is prohibited without written permission.en_US
dc.rights.urihttp://dspace.mit.edu/handle/1721.1/7582en_US
dc.subjectElectrical Engineering and Computer Scienceen_US
dc.titleScalable design of high-performance on-chip Terahertz source and imageren_US
dc.typeThesisen_US
dc.description.degreeS.M.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Scienceen_US
dc.identifier.oclc1023627601en_US


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