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dc.contributor.advisorGang Chen.en_US
dc.contributor.authorChiloyan, Vazriken_US
dc.contributor.otherMassachusetts Institute of Technology. Department of Mechanical Engineering.en_US
dc.date.accessioned2018-05-23T16:32:06Z
dc.date.available2018-05-23T16:32:06Z
dc.date.copyright2018en_US
dc.date.issued2018en_US
dc.identifier.urihttp://hdl.handle.net/1721.1/115727
dc.descriptionThesis: Ph. D., Massachusetts Institute of Technology, Department of Mechanical Engineering, 2018.en_US
dc.descriptionCataloged from PDF version of thesis.en_US
dc.descriptionIncludes bibliographical references (pages 133-140).en_US
dc.description.abstractOver time, technology has shrunk to smaller length scales, and as a result the heat transport in these systems has entered the nanoscale regime. With increasing computational speed and power consumption, there is a need to efficiently dissipate the heat generated for proper thermal management of computer chips. The ability to understand the physics of thermal transport in this regime is critical in order to model, engineer, and improve the performance of materials and devices. In the nanoscale regime, thermal transport is no longer diffusive, and the Fourier heat conduction equation, which we commonly utilize at the macroscale, fails to accurately predict heat flow at the nanoscale. We model the heat flow due to phonons (crystal lattice vibrations), the dominant heat carriers in semiconductors and dielectrics, by solving the Boltzmann transport equation (BTE) to develop an understanding of nondiffusive thermal transport and its dependence on the system geometry and material properties, such as the phonon mean free path. A variety of experimental heat transfer configurations have been established in order to achieve short time scales and small length scales in order to access the nondiffusive heat conduction regime. In this thesis, we develop a variational approach to solving the BTE, appropriate for different experimental configurations, such as transient thermal grating (TTG) and time-domain thermoreflectance (TDTR). We provide an efficient and general methodology to solving the BTE and gaining insight into the reduction of the effective thermal conductivity in the nondiffusive regime, known as classical size effects. We also extend the reconstruction procedure, which aims to utilize both modeling efforts as well as experimental measurements to back out the material properties such as phonon mean free path distributions, to provide further insight into the material properties relevant to transport. Furthermore, with the developed methodology, we aim to provide an analysis of experimental geometries with the inclusion of a thermal interface, to provide insight into the role the interface transmissivity plays in thermal transport in the nondiffusive regime. Lastly, we explore a variety of phonon source distributions that are achieved by heating a system, and show the important link between the system geometry and the distribution of phonons initiated by the heating. We show the exciting possibility that under certain nonthermal phonon distributions, it is possible to achieve enhanced thermal transport at the nanoscale, contrary to the current understanding of size effects only leading to reduced thermal conductivities at the nanoscale for thermal phonon distributions.en_US
dc.description.statementofresponsibilityby Vazrik Chiloyan.en_US
dc.format.extent140 pagesen_US
dc.language.isoengen_US
dc.publisherMassachusetts Institute of Technologyen_US
dc.rightsMIT theses are protected by copyright. They may be viewed, downloaded, or printed from this source but further reproduction or distribution in any format is prohibited without written permission.en_US
dc.rights.urihttp://dspace.mit.edu/handle/1721.1/7582en_US
dc.subjectMechanical Engineering.en_US
dc.titleVariational approach to solving the phonon Boltzmann transport equation for analyzing nanoscale thermal transport experimentsen_US
dc.typeThesisen_US
dc.description.degreePh. D.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Mechanical Engineering
dc.identifier.oclc1036986646en_US


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