Focused atmospheric-pressure microsputterer for additive manufacturing of microelectronics interconnects
Name
1056978006-MIT.pdf
Description
Full printable version
Size
7.06 MB
Format
Adobe PDF
Checksum (MD5)
9b4e2548b30d48f107a463afce48be45
Author(s)
Kornbluth, Yosef S. (Yosef Shimshon)
Advisor(s)
Luis Fernando Velásuez-García
Date Issued
2018
Publisher
Massachusetts Institute of Technology
Abstract
The past decade has seen a new manufacturing revolution, in the form of additive manufacturing. While recent additive manufacturing processes can produce structural materials in intricate shapes not previously possible, additive manufacturing of functional materials remains a challenge. In particular, functional electronics must still be made via traditional lithographic and etching processes. This thesis introduces a microsputtering method to directly write metals with high resolution. A wire feed enables continuous, extended use of the system. We motivate, simulate, and test a novel electrostatic focusing system to improve the resolution of the imprints; this focusing scheme combines electrostatic and fluid effects to direct the sputtered material into a strip as narrow as 9 pm. The microstructure of the deposits, which affects their conductivity, is also explored and modified. Using gold as printable feedstock, this technology allows for smooth (55 nm roughness) deposits with ~65X the electrical conductivity of bulk metal.
Description
Thesis: S.M., Massachusetts Institute of Technology, Department of Mechanical Engineering, 2018.
Cataloged from PDF version of thesis.
Includes bibliographical references (pages 45-49).
Subjects
Mechanical Engineering.
MIT Department
Massachusetts Institute of Technology. Department of Mechanical Engineering
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