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dc.contributor.authorBanerjee, Utsav
dc.contributor.authorJuvekar, Chiraag
dc.contributor.authorFuller, Samuel Henry
dc.contributor.authorChandrakasan, Anantha P
dc.date.accessioned2019-10-08T15:43:02Z
dc.date.available2019-10-08T15:43:02Z
dc.date.issued2018-01
dc.date.submitted2017-12
dc.identifier.isbn9781509050192
dc.identifier.urihttps://hdl.handle.net/1721.1/122466
dc.description.abstractIn the fast growing world of the Internet of Things (IoT), security has become a major concern. Datagram Transport Layer Security (DTLS) is considered to be one of the most suited protocols for securing the IoT. However, computation and communication overheads make it very expensive to implement DTLS on resource-constrained IoT sensor nodes. In this work, we profile the energy costs of DTLS 1.3, using experimental models for cryptographic computations and radio-frequency (RF) communications. Based on this analysis, we present eeDTLS, a low-energy variant of DTLS, that provides the same security strength as DTLS, but has lower energy requirements. By employing a combination of packet size reduction and optimized handshake computations, eeDTLS can provide up to 45% energy savings in a typical IoT use case. eeDTLS can be implemented in conjunction with any low-energy IoT RF protocol, and the proposed energy models and protocol optimizations can also be used to improve the energy efficiency of custom IoT security architectures.en_US
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)en_US
dc.relation.isversionofhttp://dx.doi.org/10.1109/glocom.2017.8255053en_US
dc.rightsCreative Commons Attribution-Noncommercial-Share Alikeen_US
dc.rights.urihttp://creativecommons.org/licenses/by-nc-sa/4.0/en_US
dc.sourceProf. Chandrakasanen_US
dc.titleeeDTLS: Energy-Efficient Datagram Transport Layer Security for the Internet of Thingsen_US
dc.typeArticleen_US
dc.identifier.citationBaneerjee, Utsav et al. "eeDTLS: Energy-Efficient Datagram Transport Layer Security for the Internet of Things." 2017 IEEE Global Communications Conference, December 2017, Singapore, Singapore, Institute of Electrical and Electronics Engineers (IEEE), January 2018 © 2017 IEEEen_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Scienceen_US
dc.contributor.departmentMassachusetts Institute of Technology. Microsystems Technology Laboratoriesen_US
dc.relation.journal2017 IEEE Global Communications Conferenceen_US
dc.eprint.versionAuthor's final manuscripten_US
dc.type.urihttp://purl.org/eprint/type/ConferencePaperen_US
eprint.statushttp://purl.org/eprint/status/NonPeerRevieweden_US
dc.identifier.doi10.1109/GLOCOM.2017.8255053en_US
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dspace.date.submission2019-10-04T13:41:13Z


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