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dc.contributor.advisorFrederick J. McGarry.en_US
dc.contributor.authorMargaritis, Georgiosen_US
dc.date.accessioned2005-08-16T20:01:22Z
dc.date.available2005-08-16T20:01:22Z
dc.date.copyright1994en_US
dc.date.issued1994en_US
dc.identifier.urihttp://hdl.handle.net/1721.1/12250
dc.descriptionThesis (Sc. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1994.en_US
dc.descriptionIncludes bibliographical references (leaves 160-164).en_US
dc.description.statementofresponsibilityby Georgios Margaritis.en_US
dc.format.extent165 leavesen_US
dc.format.extent9323898 bytes
dc.format.extent9323653 bytes
dc.format.mimetypeapplication/pdf
dc.format.mimetypeapplication/pdf
dc.language.isoengen_US
dc.publisherMassachusetts Institute of Technologyen_US
dc.rightsM.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.en_US
dc.rights.urihttp://dspace.mit.edu/handle/1721.1/7582
dc.subjectMaterials Science and Engineeringen_US
dc.titleThermomechanical effects in electronic packagesen_US
dc.typeThesisen_US
dc.description.degreeSc.D.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Materials Science and Engineering
dc.identifier.oclc30756249en_US


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