Show simple item record

dc.contributor.advisorDr. Retsef Levi and John Williams.en_US
dc.contributor.authorFoster, Andrew Wallace.en_US
dc.contributor.otherSloan School of Management.en_US
dc.contributor.otherMassachusetts Institute of Technology. Department of Civil and Environmental Engineering.en_US
dc.contributor.otherLeaders for Global Operations Program.en_US
dc.date.accessioned2019-10-11T22:24:42Z
dc.date.available2019-10-11T22:24:42Z
dc.date.copyright2019en_US
dc.date.issued2019en_US
dc.date.issued2019en_US
dc.identifier.urihttps://hdl.handle.net/1721.1/122584
dc.descriptionThesis: M.B.A., Massachusetts Institute of Technology, Sloan School of Management, 2019, In conjunction with the Leaders for Global Operations Program at MITen_US
dc.descriptionThesis: S.M., Massachusetts Institute of Technology, Department of Civil and Environmental Engineering, 2019, In conjunction with the Leaders for Global Operations Program at MITen_US
dc.descriptionCataloged from PDF version of thesis.en_US
dc.descriptionIncludes bibliographical references (pages 72-76).en_US
dc.description.abstractPrinted circuit boards (PCBs) are core components of virtually every modern electronic device, from smartphones to servers. Accordingly, printed circuit board assembly (PCBA) has become core to Flex, a leading electronics manufacturing services (EMS) company. As the EMS industry continues to automate the PCBA process, it captures more data and creates opportunities to leverage this data and to generate value through analytics. One such promising opportunity is using defect prediction to improve downstream yields. For instance, x-ray inspection, which mostly detects solder defects, has a yield of about 97% for one of Flex's automated PCBA lines, and an improvement even to just 98% would create significant cost savings. Given this opportunity, this project aims to use the new data captured by the first steps in the automated PCBA process to predict solder defects that are usually identified during inspection, several days after the board begins the PCBA process. Specifically, the proposed boosted trees model uses data on 20,000 solder pads to predict whether an entire board will fail a downstream x-ray test. Other, more granular models are also studied, as well as other predictive models such as logistic regression and convolutional neural network models. The model is able to identify defective PCBs with an AUC of 0.74 and improve x-ray inspection yields from 97% to 98%, using one PCBA line at Flex as a case study. A second additional use case would reduce the number of x-ray inspection machines needed. Furthermore, a pilot implementation demonstrated that the model works well enough to enable these savings to be realized in practice. At the site where this study was conducted, these two use cases are estimated to produce significant savings over the seven-year useful life of the PCBA machinery. Since Flex has over 1,500 PCBA sites, the results of this case study suggest that there is potential to scale these analytics and related savings across the company.en_US
dc.description.statementofresponsibilityby Andrew Wallace Foster.en_US
dc.format.extent76 pagesen_US
dc.language.isoengen_US
dc.publisherMassachusetts Institute of Technologyen_US
dc.rightsMIT theses are protected by copyright. They may be viewed, downloaded, or printed from this source but further reproduction or distribution in any format is prohibited without written permission.en_US
dc.rights.urihttp://dspace.mit.edu/handle/1721.1/7582en_US
dc.subjectSloan School of Management.en_US
dc.subjectCivil and Environmental Engineering.en_US
dc.subjectLeaders for Global Operations Program.en_US
dc.titlePredicting solder defects in printed circuit board assembly (PCBA) processen_US
dc.title.alternativePredicting solder defects in PCBA processen_US
dc.typeThesisen_US
dc.description.degreeM.B.A.en_US
dc.description.degreeS.M.en_US
dc.contributor.departmentSloan School of Managementen_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Civil and Environmental Engineeringen_US
dc.contributor.departmentLeaders for Global Operations Programen_US
dc.identifier.oclc1119391584en_US
dc.description.collectionM.B.A. Massachusetts Institute of Technology, Sloan School of Managementen_US
dc.description.collectionS.M. Massachusetts Institute of Technology, Department of Civil and Environmental Engineeringen_US
dspace.imported2019-10-11T22:24:41Zen_US
mit.thesis.degreeMasteren_US
mit.thesis.departmentSloanen_US
mit.thesis.departmentCivEngen_US


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record