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Sub-10 nm diameter InGaAs vertical nanowire MOSFETs

Author(s)
Vardi, A.; del Alamo, J. A.; Zhao, Xiaojun; Heidelberger, Christopher; Fitzgerald, Eugene A; Lu, W.; Vardi, Assaf; ... Show more Show less
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Abstract
We present the first sub-10 nm diameter vertical nanowire transistors of any kind in any semiconductor system. These devices are InGaAs MOSFETs fabricated by a top-down approach using reactive ion etching, alcohol-based digital etch and Ni alloyed contacts. A record I on of 350 μA/μm at I off = 100 nA/μm and V dd = 0.5 V is obtained in a 7 nm diameter device. The same device exhibits a peak transconductance (g m, pk ) of 1.7 mS/μm and minimal subthreshold swing (S) of 90 mV/dec at V ds = 0.5 V, achieving the highest quality factor (defined as the ratio g m, pk /S) of 19 reported in vertical nanowire transistors. Excellent scaling behavior is observed with g m, pk and I on increasing as the diameter is shrunk down to 7 nm.
Date issued
2018-01
URI
https://hdl.handle.net/1721.1/122650
Department
Massachusetts Institute of Technology. Microsystems Technology Laboratories; Massachusetts Institute of Technology. Center for Biomedical Engineering; Massachusetts Institute of Technology. Department of Materials Science and Engineering
Journal
2017 IEEE International Electron Devices Meeting (IEDM)
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Citation
Zhao, X. et al. "Sub-10 nm diameter InGaAs vertical nanowire MOSFETs." 2017 IEEE International Electron Devices Meeting (IEDM), December 2017, San Francisco, California, USA, Institute of Electrical and Electronics Engineers (IEEE), January 2018 © 2017 IEEE
Version: Author's final manuscript
ISBN
9781538635599
ISSN
2156-017X

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