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dc.contributor.advisorLionel C. Kimerling and Steven D. Eppinger.en_US
dc.contributor.authorSmith, Gregory J. (Gregory John)en_US
dc.date.accessioned2005-08-15T23:17:47Z
dc.date.available2005-08-15T23:17:47Z
dc.date.copyright1993en_US
dc.date.issued1993en_US
dc.identifier.urihttp://hdl.handle.net/1721.1/12393
dc.descriptionThesis (M.S.)--Massachusetts Institute of Technology, Sloan School of Management, 1993, and Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1993.en_US
dc.descriptionIncludes bibliographical references (p. 207-209).en_US
dc.description.statementofresponsibilityby Gregory J. Smith.en_US
dc.format.extent209 p.en_US
dc.format.extent14325829 bytes
dc.format.extent14325588 bytes
dc.format.mimetypeapplication/pdf
dc.format.mimetypeapplication/pdf
dc.language.isoengen_US
dc.publisherMassachusetts Institute of Technologyen_US
dc.rightsM.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.en_US
dc.rights.urihttp://dspace.mit.edu/handle/1721.1/7582
dc.subjectSloan School of Managementen_US
dc.subjectElectrical Engineering and Computer Scienceen_US
dc.titleManaging process development risk : aluminum ultrasonic wire bonding for chip-on-board applicationsen_US
dc.typeThesisen_US
dc.description.degreeM.S.en_US
dc.contributor.departmentSloan School of Managementen_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
dc.identifier.oclc29329792en_US


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