dc.contributor.advisor | Lionel C. Kimerling and Steven D. Eppinger. | en_US |
dc.contributor.author | Smith, Gregory J. (Gregory John) | en_US |
dc.date.accessioned | 2005-08-15T23:17:47Z | |
dc.date.available | 2005-08-15T23:17:47Z | |
dc.date.copyright | 1993 | en_US |
dc.date.issued | 1993 | en_US |
dc.identifier.uri | http://hdl.handle.net/1721.1/12393 | |
dc.description | Thesis (M.S.)--Massachusetts Institute of Technology, Sloan School of Management, 1993, and Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1993. | en_US |
dc.description | Includes bibliographical references (p. 207-209). | en_US |
dc.description.statementofresponsibility | by Gregory J. Smith. | en_US |
dc.format.extent | 209 p. | en_US |
dc.format.extent | 14325829 bytes | |
dc.format.extent | 14325588 bytes | |
dc.format.mimetype | application/pdf | |
dc.format.mimetype | application/pdf | |
dc.language.iso | eng | en_US |
dc.publisher | Massachusetts Institute of Technology | en_US |
dc.rights | M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. | en_US |
dc.rights.uri | http://dspace.mit.edu/handle/1721.1/7582 | |
dc.subject | Sloan School of Management | en_US |
dc.subject | Electrical Engineering and Computer Science | en_US |
dc.title | Managing process development risk : aluminum ultrasonic wire bonding for chip-on-board applications | en_US |
dc.type | Thesis | en_US |
dc.description.degree | M.S. | en_US |
dc.contributor.department | Sloan School of Management | en_US |
dc.contributor.department | Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science | |
dc.identifier.oclc | 29329792 | en_US |