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Silicon pressure sensor using wafer bonding technology

dc.contributor.advisorMartin A. Schmidt.en_US
dc.contributor.authorParameswaran, Lalithaen_US
dc.date.accessioned2005-08-16T14:08:48Z
dc.date.available2005-08-16T14:08:48Z
dc.date.copyright1993en_US
dc.date.issued1993en_US
dc.identifier.urihttp://hdl.handle.net/1721.1/12471
dc.descriptionThesis (M.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1993.en_US
dc.descriptionIncludes bibliographical references (leaves 101-105).en_US
dc.description.statementofresponsibilityby Lalitha Parameswaran.en_US
dc.format.extent105 leavesen_US
dc.format.extent7357469 bytes
dc.format.extent7357230 bytes
dc.format.mimetypeapplication/pdf
dc.format.mimetypeapplication/pdf
dc.language.isoengen_US
dc.publisherMassachusetts Institute of Technologyen_US
dc.rightsM.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.en_US
dc.rights.urihttp://dspace.mit.edu/handle/1721.1/7582
dc.subjectElectrical Engineering and Computer Scienceen_US
dc.titleSilicon pressure sensor using wafer bonding technologyen_US
dc.typeThesisen_US
dc.description.degreeM.S.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
dc.identifier.oclc29895330en_US


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