dc.contributor.advisor | Martin A. Schmidt. | en_US |
dc.contributor.author | Parameswaran, Lalitha | en_US |
dc.date.accessioned | 2005-08-16T14:08:48Z | |
dc.date.available | 2005-08-16T14:08:48Z | |
dc.date.copyright | 1993 | en_US |
dc.date.issued | 1993 | en_US |
dc.identifier.uri | http://hdl.handle.net/1721.1/12471 | |
dc.description | Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1993. | en_US |
dc.description | Includes bibliographical references (leaves 101-105). | en_US |
dc.description.statementofresponsibility | by Lalitha Parameswaran. | en_US |
dc.format.extent | 105 leaves | en_US |
dc.format.extent | 7357469 bytes | |
dc.format.extent | 7357230 bytes | |
dc.format.mimetype | application/pdf | |
dc.format.mimetype | application/pdf | |
dc.language.iso | eng | en_US |
dc.publisher | Massachusetts Institute of Technology | en_US |
dc.rights | M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. | en_US |
dc.rights.uri | http://dspace.mit.edu/handle/1721.1/7582 | |
dc.subject | Electrical Engineering and Computer Science | en_US |
dc.title | Silicon pressure sensor using wafer bonding technology | en_US |
dc.type | Thesis | en_US |
dc.description.degree | M.S. | en_US |
dc.contributor.department | Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science | |
dc.identifier.oclc | 29895330 | en_US |