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dc.contributor.advisorJuejun Hu and Lionel C. Kimerling.en_US
dc.contributor.authorKita, Derek Matthew.en_US
dc.contributor.otherMassachusetts Institute of Technology. Department of Materials Science and Engineering.en_US
dc.date.accessioned2020-05-26T23:14:21Z
dc.date.available2020-05-26T23:14:21Z
dc.date.copyright2020en_US
dc.date.issued2020en_US
dc.identifier.urihttps://hdl.handle.net/1721.1/125473
dc.descriptionThesis: Ph. D., Massachusetts Institute of Technology, Department of Materials Science and Engineering, 2020en_US
dc.descriptionCataloged from PDF version of thesis.en_US
dc.descriptionIncludes bibliographical references (pages 155-173).en_US
dc.description.abstractChemical sensing systems realized with photonic components integrated on traditional semiconductor substrates have emerged as a promising technology for remote sensing applications that require low cost, low power consumption, light weight, small size, and high-performance. In this thesis, I discuss methods and systems for practical implementations of chip-scale integrated photonic chemical sensors and spectromeƯters. The work focuses on solutions to a variety of obstacles that have hindered real-world implementations of microphotonic chemical sensors. First, a new chip arƯchitecture capable of acquiring high channel count, high resolution optical spectra (200 pm resolution in the telecommunications C-band) is presented both theoretically and experimentally, along with a new 'elastic-D₁' regularized regression method for spectrum reconstruction. Next, evanescent field sensing using dielectric waveguides is studied theoretically and numerically, with a special emphasis on sensing perforƯmance in the presence of random, fabrication-induced waveguide sidewall roughness. I demonstrate that a locally flat perturbation approximation is valid for typical experƯimental roughness in silicon-on-insulator platforms, and use a volume-current method to explicitly compute scattering loss rates for a variety of three-dimensional wavegƯuide structures. To then experimentally realize photonic sensing systems, I developed a low-loss (0.36 ± 0.11 dB/cm), quick-turn (16.4 day turnaround) fabrication process for inexpensively prototyping silicon nitride photonic integrated circuits with heaters, etched edge couplers, and opened sensing windows. Using this fabrication process, I present a successful experimental demonstration of a fiber-packaged, waveguideƯenhanced Raman spectroscopic sensor used for detecting liquids in contact with the surface of the chip via measured Raman peaks from 500 - 3500 cm⁻¹.en_US
dc.description.statementofresponsibilityby Derek Matthew Kita.en_US
dc.format.extent173 pagesen_US
dc.language.isoengen_US
dc.publisherMassachusetts Institute of Technologyen_US
dc.rightsMIT theses are protected by copyright. They may be viewed, downloaded, or printed from this source but further reproduction or distribution in any format is prohibited without written permission.en_US
dc.rights.urihttp://dspace.mit.edu/handle/1721.1/7582en_US
dc.subjectMaterials Science and Engineering.en_US
dc.titleIntegrated photonic devices for spectroscopic chemical detectionen_US
dc.typeThesisen_US
dc.description.degreePh. D.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Materials Science and Engineeringen_US
dc.identifier.oclc1155052640en_US
dc.description.collectionPh.D. Massachusetts Institute of Technology, Department of Materials Science and Engineeringen_US
dspace.imported2020-05-26T23:14:20Zen_US
mit.thesis.degreeDoctoralen_US
mit.thesis.departmentMatScien_US


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