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dc.contributor.advisorMarkus I. Flik.en_US
dc.contributor.authorGoodson, Kenneth E. (Kenneth Eugene)en_US
dc.date.accessioned2005-08-15T21:29:56Z
dc.date.available2005-08-15T21:29:56Z
dc.date.copyright1993en_US
dc.date.issued1993en_US
dc.identifier.urihttp://hdl.handle.net/1721.1/12615
dc.descriptionThesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1993.en_US
dc.descriptionIncludes bibliographical references (leaves 176-184).en_US
dc.description.statementofresponsibilityby Kenneth E. Goodson.en_US
dc.format.extent184 leavesen_US
dc.format.extent13531331 bytes
dc.format.extent13531080 bytes
dc.format.mimetypeapplication/pdf
dc.format.mimetypeapplication/pdf
dc.language.isoengen_US
dc.publisherMassachusetts Institute of Technologyen_US
dc.rightsM.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.en_US
dc.rights.urihttp://dspace.mit.edu/handle/1721.1/7582
dc.subjectMechanical Engineeringen_US
dc.titleThermal conduction in microelectronic circuitsen_US
dc.typeThesisen_US
dc.description.degreePh.D.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Mechanical Engineering
dc.identifier.oclc28274708en_US


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