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dc.contributor.authorSheng, D. N.
dc.contributor.authorFu, Liang
dc.date.accessioned2021-12-17T19:39:15Z
dc.date.available2021-10-27T19:58:13Z
dc.date.available2021-12-17T19:39:15Z
dc.date.issued2020
dc.identifier.urihttps://hdl.handle.net/1721.1/134120.2
dc.description.abstract© 2020 American Physical Society. We study the thermoelectric transport properties of fractional quantum Hall systems based on an exact diagonalization calculation. Based on the relation between the thermoelectric response and thermal entropy, we demonstrate that thermoelectric Hall conductivity αxy has power-law scaling αxy Tη for gapless composite Fermi-liquid states at filling numbers ν=1/2 and 1/4 at low temperatures (T), with an exponent η∼0.5 distinctly different from Fermi liquids. The power-law scaling remains unchanged for different forms of interaction including Coulomb and short-range ones, demonstrating the robustness of non-Fermi-liquid behavior of these interacting systems at low T. In contrast, for the 1/3 fractional quantum Hall state, αxy vanishes at low T with an activation gap associated with neutral collective modes rather than charged quasiparticles. Our results establish another manifestation of the non-Fermi-liquid nature of quantum Hall fluids at a finite temperature.en_US
dc.language.isoen
dc.publisherAmerican Physical Society (APS)en_US
dc.relation.isversionof10.1103/PhysRevB.101.241101en_US
dc.rightsArticle is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.en_US
dc.sourceAPSen_US
dc.titleThermoelectric response and entropy of fractional quantum Hall systemsen_US
dc.typeArticleen_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Physicsen_US
dc.relation.journalPhysical Review Ben_US
dc.eprint.versionFinal published versionen_US
dc.type.urihttp://purl.org/eprint/type/JournalArticleen_US
eprint.statushttp://purl.org/eprint/status/PeerRevieweden_US
dc.date.updated2021-07-12T12:24:48Z
dspace.orderedauthorsSheng, DN; Fu, Len_US
dspace.date.submission2021-07-12T12:24:49Z
mit.journal.volume101en_US
mit.journal.issue24en_US
mit.licensePUBLISHER_POLICY
mit.metadata.statusPublication Information Neededen_US


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