| dc.contributor.author | Sundaram, Subramanian | |
| dc.contributor.author | Kim, David Saerom | |
| dc.contributor.author | Baldo, Marc A | |
| dc.contributor.author | Hayward, Ryan C. | |
| dc.contributor.author | Matusik, Wojciech | |
| dc.date.accessioned | 2022-04-14T19:19:42Z | |
| dc.date.available | 2021-10-27T20:09:28Z | |
| dc.date.available | 2022-04-14T19:19:42Z | |
| dc.date.issued | 2017 | |
| dc.identifier.uri | https://hdl.handle.net/1721.1/134848.2 | |
| dc.description.abstract | © 2017 American Chemical Society. Self-transforming structures are gaining prominence due to their general ability to adopt programmed shapes each tailored for specific functions. Composites that self-fold have so far relied on using the stimuli-responsive mechanisms focusing on reversible shape change. Integrating additional functions within these composites can rapidly enhance their practical applicability; however, this remains a challenging problem. Here, we demonstrate a method for spontaneous folding of three-dimensional (3D)-printed composites with embedded electronics at room temperature. The composite is printed using a multimaterial 3D-printing process with no external processing steps. Upon peeling from the print platform, the composite self-shapes itself using the residual forces resulting from polymer swelling during the layer-by-layer fabrication process. As a specific example, electrochromic elements are printed within the composite and can be electrically controlled through its folded legs. Our shape-transformation scheme provides a route to transform planar electronics into nonplanar geometries containing the overhangs. Integrating electronics within complex 3D shapes can enable new applications in sensing and robotics. | en_US |
| dc.language.iso | en | |
| dc.publisher | American Chemical Society (ACS) | en_US |
| dc.relation.isversionof | 10.1021/ACSAMI.7B10443 | en_US |
| dc.rights | Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use. | en_US |
| dc.source | ACS | en_US |
| dc.title | 3D-Printed Self-Folding Electronics | en_US |
| dc.type | Article | en_US |
| dc.contributor.department | Massachusetts Institute of Technology. Computer Science and Artificial Intelligence Laboratory | en_US |
| dc.contributor.department | Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science | en_US |
| dc.relation.journal | ACS Applied Materials & Interfaces | en_US |
| dc.eprint.version | Final published version | en_US |
| dc.type.uri | http://purl.org/eprint/type/JournalArticle | en_US |
| eprint.status | http://purl.org/eprint/status/PeerReviewed | en_US |
| dc.date.updated | 2019-05-03T17:34:30Z | |
| dspace.orderedauthors | Sundaram, S; Kim, DS; Baldo, MA; Hayward, RC; Matusik, W | en_US |
| dspace.date.submission | 2019-05-03T17:34:33Z | |
| mit.journal.volume | 9 | en_US |
| mit.journal.issue | 37 | en_US |
| mit.metadata.status | Publication Information Needed | en_US |