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dc.contributor.authorSundaram, Subramanian
dc.contributor.authorKim, David Saerom
dc.contributor.authorBaldo, Marc A
dc.contributor.authorHayward, Ryan C.
dc.contributor.authorMatusik, Wojciech
dc.date.accessioned2022-04-14T19:19:42Z
dc.date.available2021-10-27T20:09:28Z
dc.date.available2022-04-14T19:19:42Z
dc.date.issued2017
dc.identifier.urihttps://hdl.handle.net/1721.1/134848.2
dc.description.abstract© 2017 American Chemical Society. Self-transforming structures are gaining prominence due to their general ability to adopt programmed shapes each tailored for specific functions. Composites that self-fold have so far relied on using the stimuli-responsive mechanisms focusing on reversible shape change. Integrating additional functions within these composites can rapidly enhance their practical applicability; however, this remains a challenging problem. Here, we demonstrate a method for spontaneous folding of three-dimensional (3D)-printed composites with embedded electronics at room temperature. The composite is printed using a multimaterial 3D-printing process with no external processing steps. Upon peeling from the print platform, the composite self-shapes itself using the residual forces resulting from polymer swelling during the layer-by-layer fabrication process. As a specific example, electrochromic elements are printed within the composite and can be electrically controlled through its folded legs. Our shape-transformation scheme provides a route to transform planar electronics into nonplanar geometries containing the overhangs. Integrating electronics within complex 3D shapes can enable new applications in sensing and robotics.en_US
dc.language.isoen
dc.publisherAmerican Chemical Society (ACS)en_US
dc.relation.isversionof10.1021/ACSAMI.7B10443en_US
dc.rightsArticle is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.en_US
dc.sourceACSen_US
dc.title3D-Printed Self-Folding Electronicsen_US
dc.typeArticleen_US
dc.contributor.departmentMassachusetts Institute of Technology. Computer Science and Artificial Intelligence Laboratoryen_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Scienceen_US
dc.relation.journalACS Applied Materials & Interfacesen_US
dc.eprint.versionFinal published versionen_US
dc.type.urihttp://purl.org/eprint/type/JournalArticleen_US
eprint.statushttp://purl.org/eprint/status/PeerRevieweden_US
dc.date.updated2019-05-03T17:34:30Z
dspace.orderedauthorsSundaram, S; Kim, DS; Baldo, MA; Hayward, RC; Matusik, Wen_US
dspace.date.submission2019-05-03T17:34:33Z
mit.journal.volume9en_US
mit.journal.issue37en_US
mit.metadata.statusPublication Information Neededen_US


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