PCB Origami: A Material-Based Design Approach to Computer-Aided Foldable Electronic Devices
Author(s)
Sterman, Yoav; Demaine, Erik D; Oxman, Neri
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Origami is traditionally implemented in paper of homogeneous material properties. This research explores the use of material with embedded electronics such as PCB (Printed Circuit Boards) as the medium for origami folding in order to create an interactive folding experience and to generate foldable objects with added functionalities. PCBs are produced as 2D shapes. By folding PCB arrays it is possible to create 3D objects that contain electronic functions. Conductivity, output devices (such as Light Emitting Diodes) and microcontroller computation can create an interactive folding experience, for user guidance and verification of the folding. We call this approach and methodology PCB Origami. The work presented in this paper describes two unique interaction and fabrication techniques for creating and folding electronic materials. We demonstrate prototypes and present verification/evaluation strategies for guiding the user through the folding process. Copyright © 2013 by ASME.
Date issued
2013-08Department
Massachusetts Institute of Technology. Media Laboratory; Massachusetts Institute of Technology. Computer Science and Artificial Intelligence Laboratory; Massachusetts Institute of Technology. Department of Electrical Engineering and Computer SciencePublisher
American Society of Mechanical Engineers
Citation
Sterman, Yoav, Demaine, Erik D. and Oxman, Neri. 2013. "PCB Origami: A Material-Based Design Approach to Computer-Aided Foldable Electronic Devices."
Version: Final published version