dc.contributor.author | Yi, Xiang | |
dc.contributor.author | Wang, Jinchen | |
dc.contributor.author | Colangelo, Marco | |
dc.contributor.author | Wang, Cheng | |
dc.contributor.author | Kolodziej, Kenneth E | |
dc.contributor.author | Han, Ruonan | |
dc.date.accessioned | 2022-06-29T17:36:15Z | |
dc.date.available | 2022-06-29T17:36:15Z | |
dc.date.issued | 2021 | |
dc.identifier.uri | https://hdl.handle.net/1721.1/143594 | |
dc.language.iso | en | |
dc.publisher | Institute of Electrical and Electronics Engineers (IEEE) | en_US |
dc.relation.isversionof | 10.1109/JSSC.2021.3062079 | en_US |
dc.rights | Creative Commons Attribution-Noncommercial-Share Alike | en_US |
dc.rights.uri | http://creativecommons.org/licenses/by-nc-sa/4.0/ | en_US |
dc.source | MIT web domain | en_US |
dc.title | Realization of In-Band Full-Duplex Operation at 300 and 4.2 K Using Bilateral Single-Sideband Frequency Conversion | en_US |
dc.type | Article | en_US |
dc.identifier.citation | Yi, Xiang, Wang, Jinchen, Colangelo, Marco, Wang, Cheng, Kolodziej, Kenneth E et al. 2021. "Realization of In-Band Full-Duplex Operation at 300 and 4.2 K Using Bilateral Single-Sideband Frequency Conversion." IEEE Journal of Solid-State Circuits, 56 (5). | |
dc.contributor.department | Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science | |
dc.contributor.department | Lincoln Laboratory | |
dc.relation.journal | IEEE Journal of Solid-State Circuits | en_US |
dc.eprint.version | Author's final manuscript | en_US |
dc.type.uri | http://purl.org/eprint/type/JournalArticle | en_US |
eprint.status | http://purl.org/eprint/status/PeerReviewed | en_US |
dc.date.updated | 2022-06-29T16:43:03Z | |
dspace.orderedauthors | Yi, X; Wang, J; Colangelo, M; Wang, C; Kolodziej, KE; Han, R | en_US |
dspace.date.submission | 2022-06-29T16:43:07Z | |
mit.journal.volume | 56 | en_US |
mit.journal.issue | 5 | en_US |
mit.license | OPEN_ACCESS_POLICY | |
mit.metadata.status | Authority Work and Publication Information Needed | en_US |