Fully 3D‐Printed, Ultrathin Capacitors via Multi‐Material Microsputtering

Author(s)
Kornbluth, Yosef S; Parameswaran, Lalitha; Mathews, Richard; Racz, Livia M; Velásquez-García, Luis F
Thumbnail
DownloadPublished version (1.869Mb)
Publisher with Creative Commons License
Terms of use
Creative Commons Attribution 4.0 International license https://creativecommons.org/licenses/by/4.0/
Metadata
Show full item record
Date issued
2022
URI
https://hdl.handle.net/1721.1/145738
Department
Massachusetts Institute of Technology. Microsystems Technology Laboratories; Lincoln Laboratory; Massachusetts Institute of Technology. Department of Mechanical Engineering
Journal
Advanced Materials Technologies
Publisher
Wiley
Citation
Kornbluth, Yosef S, Parameswaran, Lalitha, Mathews, Richard, Racz, Livia M and Velásquez-García, Luis F. 2022. "Fully 3D‐Printed, Ultrathin Capacitors via Multi‐Material Microsputtering." Advanced Materials Technologies, 7 (8).
Version: Final published version
Collections