Routing the Power and Ground Wires on a VLSI Chip
| dc.contributor.advisor | Rivest, Ronald L. | en_US |
| dc.contributor.author | Moulton, Andrew Strout | en_US |
| dc.date.accessioned | 2023-03-29T15:10:32Z | |
| dc.date.available | 2023-03-29T15:10:32Z | |
| dc.date.issued | 1984-05 | |
| dc.identifier.uri | https://hdl.handle.net/1721.1/149595 | |
| dc.description.abstract | This thesis presents four new algorithms to route noncrossing power and ground trees in one metal layer of a VLSI chip. The implementation of the best algorithm forms MIT's Placement-Interconnect (PI) Project's power-ground routing phase. The input to this power-ground algorithm is a set of rectangular modules on a rectangular chip. | en_US |
| dc.relation.ispartofseries | MIT-LCS-TR-322 | |
| dc.title | Routing the Power and Ground Wires on a VLSI Chip | en_US |
| dc.identifier.oclc | 11897020 |
