Laser‐Enabled Fabrication of Flexible Printed Electronics with Integrated Functional Devices

Abstract

The demand for flexible and printed electronics in wearable and soft roboticsapplications has increased the need for scalable, additive manufacturingprocesses. However, traditional printed circuit board manufacturing involvescomplex, multistep processes, is limited to certain substrates, and faceschallenges in integrating functional devices. Here, an additive, laser-enabledprocess is introduced for fabricating flexible, double-sided printed electronicsleveraging laser-induced graphene (LIG) as a seed layer for selective copperelectrodeposition (E-LIG). This technique enables precise conductive circuitpatterning down to 50 µm and is reliable via formation in a single streamlinedprocess. E-LIG supports transfer to various substrates, allowing for large-areaelectronics up to 100 cm2 , broadening applications in large-scale interfaces.Functional LIG device integration, including sensors and actuators, directlyinterfaced with control circuits on a single substrate is demonstrated.Applications such as real-time graphical output and interactive interfacingshowcase the method’s versatility. E-LIG exhibits repairability for on-demandrestoration of damaged circuits, enhancing durability and offering a scalable,cost-effective solution for multifunctional printed electronics.