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dc.contributor.advisorGang Chen.en_US
dc.contributor.authorSchmidt, Aaron Jerome, 1979-en_US
dc.contributor.otherMassachusetts Institute of Technology. Dept. of Mechanical Engineering.en_US
dc.date.accessioned2005-09-06T21:49:23Z
dc.date.available2005-09-06T21:49:23Z
dc.date.copyright2004en_US
dc.date.issued2004en_US
dc.identifier.urihttp://hdl.handle.net/1721.1/27116
dc.descriptionThesis (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2004.en_US
dc.descriptionIncludes bibliographical references (p. 65-67).en_US
dc.description.abstractContact thermal lithography is a method for fabricating microscale patterns using heat transfer. In contrast to photolithography, where the minimum achievable feature size is proportional to the wavelength of light used in the exposure process, thermal lithography is limited by a thermal diffusion length scale and the geometry of the situation. In this thesis the basic principles of thermal lithography are presented. A traditional chrome-glass photomask is brought into contact with a wafer coated with a thermally sensitive polymer. The mask-wafer combination is flashed briefly with high intensity light, causing the chrome features heat up and conduct heat locally to the polymer, transferring a pattern. Analytic and finite element models are presented to analyze the heating process and select appropriate geometries and heating times. In addition, an experimental version of a contact thermal lithography system has been constructed and tested. Early results from this system are presented, along with plans for future development.en_US
dc.description.statementofresponsibilityby Aaron Jerome Schmidt.en_US
dc.format.extent67 p.en_US
dc.format.extent4084917 bytes
dc.format.extent4091394 bytes
dc.format.mimetypeapplication/pdf
dc.format.mimetypeapplication/pdf
dc.language.isoen_US
dc.publisherMassachusetts Institute of Technologyen_US
dc.rightsM.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.en_US
dc.rights.urihttp://dspace.mit.edu/handle/1721.1/7582
dc.subjectMechanical Engineering.en_US
dc.titleContact thermal lithographyen_US
dc.typeThesisen_US
dc.description.degreeS.M.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Mechanical Engineering
dc.identifier.oclc56842326en_US


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