Nanostructure fabrication by electron and ion beam patterning of nanoparticles
Author(s)
Kong, David Sun, 1979-
DownloadFull printable version (17.18Mb)
Other Contributors
Massachusetts Institute of Technology. Dept. of Architecture. Program in Media Arts and Sciences.
Advisor
Joseph Jacobson.
Terms of use
Metadata
Show full item recordAbstract
Two modes of energetic beam-mediated fabrication have been investigated, namely focused ion beam (FIB) direct-writing of nanoparticles, and a technique for electrostatically patterning ionized inorganic nanoparticles, termed nanoxerography. A FIB has been used to directly pattern thin films of organometallic Ag-precursors down to a resolution of 100 nm. The sensitivity of the resist to 30 keV Ga+ ions was measured to be approximately 5 C/cm2. Using this technique arbitrary structures were fabricated in two and three dimensions with resistivity on the order of 1x10 4 Q-cm and 1x1 0-5 Q-cm for single- and multi-layer structures, respectively. A new unit of merit for characterizing direct-write processes, termed resistivity-dose (Q-jC/cm), has been introduced. A Nanocluster Source capable of generating a beam of charged, inorganic nanoparticles has been characterized. The relationship between power supplied to the magnetron of the source and the size of deposited clusters has been plotted. Techniques for utilizing such clusters to develop latent electrified images patterned by an electron beam (EB) have been proposed. The charge-storing characteristics of a variety of substrates such as mylar and polyimide were studied by developing EB-patterned charge images with toner particles.
Description
Thesis (S.M.)--Massachusetts Institute of Technology, School of Architecture and Planning, Program in Media Arts and Sciences, 2004. Includes bibliographical references (leaves 82-83).
Date issued
2004Department
Program in Media Arts and Sciences (Massachusetts Institute of Technology)Publisher
Massachusetts Institute of Technology
Keywords
Architecture. Program in Media Arts and Sciences.