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dc.contributor.advisorFrederick J. McGarry.en_US
dc.contributor.authorSatorius, Andrew, 1980-en_US
dc.contributor.otherMassachusetts Institute of Technology. Dept. of Materials Science and Engineering.en_US
dc.date.accessioned2006-03-24T18:21:51Z
dc.date.available2006-03-24T18:21:51Z
dc.date.issued2004en_US
dc.identifier.urihttp://hdl.handle.net/1721.1/30125
dc.descriptionThesis (S.M.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, February 2004.en_US
dc.description"January 2004."en_US
dc.descriptionIncludes bibliographical references (leaves 77-78).en_US
dc.description.abstractThe critical thickness at which a toughness transition occurs in a polymer was determined for the Dow Corning 4-3136 silicone resin. 4-3136 is macroscopically brittle, but becomes up to ten times more ductile when it is processed in the form of a sufficiently thin film. Thickness was controlled for the thin films of amorphous polymer through solution composition variation. The films were spun on highly polished stainless steel at a constant angular velocity. The transition was observed over a range of film thicknesses at several different curing temperatures. Observation of cracking induced by bending and tensile strain was used as the gauge for the transition from brittle to ductile. The critical thickness was observed to have an unambiguous value at low curing temperatures. At higher curing temperatures, the transition occurred more gradually. The critical thickness also increased up to intermediate curing temperatures, then decreased at the highest cure temperature. Crosslink density is theorized as the cause for this cure temperature induced alteration of the critical thickness.en_US
dc.description.statementofresponsibilityby Andrew Satorius.en_US
dc.format.extent78 leavesen_US
dc.format.extent3120015 bytes
dc.format.extent3119823 bytes
dc.format.mimetypeapplication/pdf
dc.format.mimetypeapplication/pdf
dc.language.isoengen_US
dc.publisherMassachusetts Institute of Technologyen_US
dc.rightsM.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.en_US
dc.rights.urihttp://dspace.mit.edu/handle/1721.1/7582
dc.subjectMaterials Science and Engineering.en_US
dc.titleCritical thickness in silicone resinen_US
dc.typeThesisen_US
dc.description.degreeS.M.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Materials Science and Engineering
dc.identifier.oclc55872220en_US


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