Solution for a modular die-level anodic bonder

Abstract

Anodic bonding is a common way to package silicon with Pyrex. The anodic bonding process requires high temperature, voltage, and moderate pressure to occur. Often, there are also expectations of alignment of features for things such as power or material delivery. The following thesis proposes a design for a die-level anodic bonding apparatus. It consists of a separate module to meet each requirement; a module for heating, aligning, and applying force. The apparatus is capable of heating the MEMS device to over 400⁰C, applying more than 1000V across the device, applying greater than 4MPa of pressure, and aligning to within 0.5[micro]m in two directions to create an accurately aligned anodic bond. The apparatus met all of these functional requirements and is modular. enough to easily be configured for many other die-level anodic bonding situations.