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dc.contributor.advisorAlexander Slocum.en_US
dc.contributor.authorFigueroa, Victor, 1982-en_US
dc.contributor.otherMassachusetts Institute of Technology. Dept. of Mechanical Engineering.en_US
dc.date.accessioned2006-05-15T20:33:16Z
dc.date.available2006-05-15T20:33:16Z
dc.date.copyright2004en_US
dc.date.issued2004en_US
dc.identifier.urihttp://hdl.handle.net/1721.1/32831
dc.descriptionThesis (S.B.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2004.en_US
dc.descriptionIncludes bibliographical references (leaf 25).en_US
dc.description.abstractA device was designed and manufactured to precisely cleave silicon wafers. Two vacuum chucks were designed to support a 150 mm diameter silicon wafer and cleave it by providing a pure moment at a pre-etched v-notch while a vacuum was created on either side of the cut. The design of the vacuum chucks would also accommodate the smaller pieces of the wafer and would allow for the cleaving process to yield 19 mm x 34 mm die. The overall system consisted of three main components: the stationary vacuum chuck, and the pivoting vacuum chuck, and the base plate, which supported the two vacuum chucks. Hinges connected the two vacuum chucks and allowed one to cleave a silicon wafer resting atop the two chucks simply by applying a small load on the handle of the pivoting chuck. The system was manufactured, assembled, and tested to prove its functionality.en_US
dc.description.statementofresponsibilityby Victor Figueroa.en_US
dc.format.extent28 leavesen_US
dc.format.extent1666968 bytes
dc.format.extent1665614 bytes
dc.format.mimetypeapplication/pdf
dc.format.mimetypeapplication/pdf
dc.language.isoengen_US
dc.publisherMassachusetts Institute of Technologyen_US
dc.rightsM.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.en_US
dc.rights.urihttp://dspace.mit.edu/handle/1721.1/7582
dc.subjectMechanical Engineering.en_US
dc.titleDesigning a mechanism to cleave silicon wafersen_US
dc.typeThesisen_US
dc.description.degreeS.B.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Dept. of Mechanical Engineering.en_US
dc.identifier.oclc60523904en_US


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