Passive microfluidic interconnects
Author(s)Jonnalagadda, Aparna S
Massachusetts Institute of Technology. Dept. of Mechanical Engineering.
Alexander H. Slocum.
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Equipment and procedures were developed to test two passive microfluidic interconnect rings held together by the friction forces on the contact surfaces. The second design forms fluid seals by means of thin flared rings of compliant material being compressed into undersized sockets. Interconnects were tested in pairs and arrays. The sealing performance of the first design was found to be highly dependent on the material and surface finish of the features, and the design was found to be largely intolerant to the misalignment inherent in arrays. The second design successfully seals up to 150 psi and is capable of compensating for misalignment to seal in arrays of six interconnects.
Thesis (S.B.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2005.Includes bibliographical references (leaf 44).
DepartmentMassachusetts Institute of Technology. Dept. of Mechanical Engineering.
Massachusetts Institute of Technology