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dc.contributor.advisorAnantha P. Chandrakasan.en_US
dc.contributor.authorLajevardi, Payamen_US
dc.contributor.otherMassachusetts Institute of Technology. Dept. of Electrical Engineering and Computer Science.en_US
dc.date.accessioned2006-11-07T11:48:37Z
dc.date.available2006-11-07T11:48:37Z
dc.date.copyright2005en_US
dc.date.issued2005en_US
dc.identifier.urihttp://hdl.handle.net/1721.1/34365
dc.descriptionThesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2005.en_US
dc.descriptionIncludes bibliographical references (p. 67-71).en_US
dc.description.abstractThe intercornnect delay in the new generations of integrated circuits imposes a significant limitation on the performance of ICs. 3-Dimensional integration of integrated circuits had been proposed to improve the interconnect delay. In this research, the effect of 3-D integration on the delay and power of FPGA chips is analyzed. Different physical partitioning of FPGAs is proposed for 3-D integration and one is analyzed in detail. The size of 3-D FPGAs differs from the size of 2-D FPGAs because of the overhead of 3-1D connections and different connectivity in switch blocks. Layout of 2-D and 3-D FPGAs is prepared to compare their size. To compare 3-D and 2-D FPGAs properly, two basic routability metrics are proposed to compare the routability of 3-D and 2-D circuits. Then, the delay of a 2-D and a 3-D FPGA with the same routability is compared. It is shown that 20%-29% delay improvement can be achieved by using a 3-D FPGA. In addition, the power consumption of 3-D FPGAs is analyzed. It is shown that if the supply voltage and the operating frequency of a 3-D FPGA are held to be the same as a 2-D FPGA, 17%-22% power improvement can be achieved. However, 3-D FPGAs can run faster since their delay is improved as well. If the delay improvement is traded off for more power saving by lowering the supply voltage, 35%-39% power improvement can be expected. Finally, to reduce the magnitude of supply current required for an integrated circuit, the method of stacking logic circuits is analyzed. This method requires level conversion between different supply domains. In this research, the architecture of several level converters are described and their delays are compared.en_US
dc.description.statementofresponsibilityby Payam Lajevardi.en_US
dc.format.extent71 p.en_US
dc.format.extent3312533 bytes
dc.format.extent3315175 bytes
dc.format.mimetypeapplication/pdf
dc.format.mimetypeapplication/pdf
dc.language.isoengen_US
dc.publisherMassachusetts Institute of Technologyen_US
dc.rightsM.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.en_US
dc.rights.urihttp://dspace.mit.edu/handle/1721.1/7582
dc.subjectElectrical Engineering and Computer Science.en_US
dc.titleDesign of a 3-dimension FPGAen_US
dc.title.alternativeDesign of a 3D Field Programmable Gate Arrayen_US
dc.typeThesisen_US
dc.description.degreeS.M.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
dc.identifier.oclc70079187en_US


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