Development of three-dimensional passive components for power electronics

Abstract

As component and power densities have increased, printed circuit boards (PCBs) have taken on additional functionality including heatsinking and forming constituent parts of electrical components. PCBs are not well suited to these tasks. A novel fabrication method is proposed to develop an enhanced circuit board fabrication approach which overcomes this problem. This method uses a photoresistive scaffold and subsequent metallization to realize the proposed structures. These structures are suitable as heatsinks, inductor windings, busbars and EMI shields among other applications.