Development of three-dimensional passive components for power electronics
Author(s)Cantillon-Murphy, Pádraig J
Development of 3D passive components for power electronics
Massachusetts Institute of Technology. Dept. of Electrical Engineering and Computer Science.
David J. Perreault.
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As component and power densities have increased, printed circuit boards (PCBs) have taken on additional functionality including heatsinking and forming constituent parts of electrical components. PCBs are not well suited to these tasks. A novel fabrication method is proposed to develop an enhanced circuit board fabrication approach which overcomes this problem. This method uses a photoresistive scaffold and subsequent metallization to realize the proposed structures. These structures are suitable as heatsinks, inductor windings, busbars and EMI shields among other applications.
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2005.Includes bibliographical references (leaves 85-88).
DepartmentMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
Massachusetts Institute of Technology
Electrical Engineering and Computer Science.