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dc.contributor.advisorJacob K. White and Luca Daniel.en_US
dc.contributor.authorHu, Xin, 1979-en_US
dc.contributor.otherMassachusetts Institute of Technology. Dept. of Electrical Engineering and Computer Science.en_US
dc.date.accessioned2008-01-10T17:30:50Z
dc.date.available2008-01-10T17:30:50Z
dc.date.copyright2006en_US
dc.date.issued2006en_US
dc.identifier.urihttp://dspace.mit.edu/handle/1721.1/35597en_US
dc.identifier.urihttp://hdl.handle.net/1721.1/35597
dc.descriptionThesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2006.en_US
dc.descriptionIncludes bibliographical references (leaves 137-145).en_US
dc.description.abstractDesigners of high-performance integrated circuits are paying ever-increasing attention to minimizing problems associated with interconnects such as noise, signal delay, crosstalk, etc., many of which are caused by the presence of a conductive substrate. The severity of these problems increases as integrated circuit clock frequencies rise into the multiple gigahertz range. In this thesis, a simulation tool is presented for the extraction of full-wave interconnect impedances in the presence of a conducting substrate. The substrate effects are accounted for through the use of full-wave layered Green's functions in a mixed-potential integral equation (MPIE) formulation. Particularly, the choice of implementation for the layered Green's function kernels motivates the development of accelerated techniques for both their 3D volume and 2D surface integrations, where each integration type can be reduced to a sum of D line integrals. In addition, a set of high-order, frequency-independent basis functions is developed with the ability to parameterize the frequency-dependent nature of the solution space, hence reducing the number of unknowns required to capture the interconnects' frequency-variant behavior.en_US
dc.description.abstract(cont.) Moreover, a pre-corrected FFT acceleration technique, conventional for the treatment of scalar Green's function kernels, is extended in the solver to accommodate the dyadic Green's function kernels encountered in the substrate modeling problem. Overall, the integral-equation solver, combined with its numerous acceleration techniques, serves as a viable solution to full-wave substrate impedance extractions of large and complex interconnect structures.en_US
dc.description.statementofresponsibilityby Xin Hu.en_US
dc.format.extent145 leavesen_US
dc.language.isoengen_US
dc.publisherMassachusetts Institute of Technologyen_US
dc.rightsM.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.en_US
dc.rights.urihttp://dspace.mit.edu/handle/1721.1/35597en_US
dc.rights.urihttp://dspace.mit.edu/handle/1721.1/7582
dc.subjectElectrical Engineering and Computer Science.en_US
dc.titleFull-wave analysis of large conductor systems over substrateen_US
dc.typeThesisen_US
dc.description.degreePh.D.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
dc.identifier.oclc74908237en_US


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