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Now showing items 1-7 of 7
Effect of Wafer Bow and Etch Patterns in Direct Wafer Bonding
(2003-01)
Direct wafer bonding has been identified as an en-abling technology for microelectromechanical systems (MEMS). As the complexity of devices increase and the bonding of multiple patterned wafers is required, there is a need ...
Processing, Structure, Properties, and Reliability of Metals for Microsystems
(2002-01)
Research on the processing, structure, properties and reliability of metal films and metallic microdevice elements is reviewed. Recent research has demonstrated that inelastic deformation mechanisms of metallic films and ...
Characterization and Modeling of Chemical-Mechanical Polishing for Polysilicon Microstructures
(2004-01)
Long the dominant method of wafer planarization in the integrated circuit (IC) industry, chemical-mechanical polishing is starting to play an important role in microelectromechnical systems (MEMS). We present an experiment ...
Performance-Driven Microfabrication-Oriented Methodology for MEMS Conceptual Design with Application in Microfluidic Device Design
(2005-01)
Performance and manufacturability are two important issues that must be taken into account during MEMS design. Existing MEMS design models or systems follow a process-driven design paradigm, that is, design starts from the ...
A Novel Testing Apparatus for Tribological Studies at the Small Scale
(2002-01)
A novel flexure-based biaxial compression/shear apparatus has been designed, built, and utilized to conduct tribological studies of interfaces relevant to MEMS. Aspects of our new apparatus are detailed and its capabilities ...
TiNi-based thin films for MEMS applications
(2004-01)
In this paper, some critical issues and problems in the development of TiNi thin films were discussed, including preparation and characterization considerations, residual stress and adhesion, frequency improvement, fatigue ...
Research on Polycrystalline Films for Micro- and Nano-Systems
(2003-01)
Polycrystalline films are used in a wide array of micro- and nano-scale devices, for electronic, mechanical, magnetic, photonic and chemical functions. Increasingly, the properties, performance, and reliability of films ...