Browsing Advanced Materials for Micro- and Nano-Systems (AMMNS) by Author "Tsang, Chi-fo"
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Preliminary Characterisation of Low-Temperature Bonded Copper Interconnects for 3-D Integrated Circuits
Leong, Hoi Liong; Gan, C.L.; Pey, Kin Leong; Tsang, Chi-fo; Thompson, Carl V.; e.a. (2005-01)Three dimensional (3-D) integrated circuits can be fabricated by bonding previously processed device layers using metal-metal bonds that also serve as layer-to-layer interconnects. Bonded copper interconnects test structures ...