Browsing Advanced Materials for Micro- and Nano-Systems (AMMNS) by Subject "compression modeling"

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    • Review of Direct Metal Bonding for Microelectronic Interconnections 

      Zhang, G.G.; Wong, Chee Cheong (2004-01)
      Microelectronic interconnections require advanced joining techniques. Direct metal bonding methods, which include thercomsonic and thermocompression bonding, offer remarkable advantages over soldering and adhesives joining. ...