Browsing Advanced Materials for Micro- and Nano-Systems (AMMNS) by Subject "wafer-wafer bonding"
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Effects of Applied Loads, Effective Contact Area and Surface Roughness on the Dicing Yield of 3D Cu Bonded Interconnects (2006-01)Bonded copper interconnects were created using thermo-compression bonding and the dicing yield was used as an indication of the bond quality. SEM images indicated that the Cu was plastically deformed. Our experimental and ...