Now showing items 1-5 of 5
Effect of Wafer Bow and Etch Patterns in Direct Wafer Bonding
Direct wafer bonding has been identified as an en-abling technology for microelectromechanical systems (MEMS). As the complexity of devices increase and the bonding of multiple patterned wafers is required, there is a need ...
Processing, Structure, Properties, and Reliability of Metals for Microsystems
Research on the processing, structure, properties and reliability of metal films and metallic microdevice elements is reviewed. Recent research has demonstrated that inelastic deformation mechanisms of metallic films and ...
A Novel Testing Apparatus for Tribological Studies at the Small Scale
A novel flexure-based biaxial compression/shear apparatus has been designed, built, and utilized to conduct tribological studies of interfaces relevant to MEMS. Aspects of our new apparatus are detailed and its capabilities ...
TiNi-based thin films for MEMS applications
In this paper, some critical issues and problems in the development of TiNi thin films were discussed, including preparation and characterization considerations, residual stress and adhesion, frequency improvement, fatigue ...
Research on Polycrystalline Films for Micro- and Nano-Systems
Polycrystalline films are used in a wide array of micro- and nano-scale devices, for electronic, mechanical, magnetic, photonic and chemical functions. Increasingly, the properties, performance, and reliability of films ...