Now showing items 1-6 of 6
Fatal Void Size Comparisons in Via-Below and Via-Above Cu Dual-Damascene Interconnects
The median-times-to-failure (t₅₀’s) for straight dual-damascene via-terminated copper interconnect structures, tested under the same conditions, depend on whether the vias connect down to underlaying leads ...
Observation of Joule Heating-Assisted Electromigration Failure Mechanisms for Dual Damascene Cu/SiO₂ Interconnects
Failure mechanisms observed in electromigration (EM) stressed dual damascene Cu/SiO₂ interconnects trees were studied and simulated. Failure sites with âmelt patch’ or âcrater’ are common for test structures in the top ...
Reliability of Multi-Terminal Copper Dual-Damascene Interconnect Trees
Electromigration tests on different Cu dual-damascene interconnect tree structures consisting of various numbers of straight via-to-via lines connected at the common middle terminal have been carried out. Like Al-based ...
Investigation of the Fundamental Reliability Unit for Cu Dual-Damascene Metallization
An investigation has been carried out to determine the fundamental reliability unit of copper dual-damascene metallization. Electromigration experiments have been carried out on straight via-to-via interconnects in the ...
Research Summary: The Effect of Microstructure on the Macroscopic Response of Electroactive Systems
A framework to model the effect of the microstructural features and crystallographic anisotropy on the macroscopic response of electractive ceramics is described. The model accounts for mechanical, electric and concentration ...
Mortality Dependence of Cu Dual Damascene Interconnects on Adjacent Segments
Electromigration experiments have been carried out on straight interconnects that have single vias at each end, and are divided into two segments by a via in the center ("dotted-I" structures). For dotted-i structures in ...