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Carbon Nanotube Growth Using Ni Catalyst in Different Layouts 

Nguyen, H. Q.; Krishnan, R.; Choi, K. W.; Thompson, Carl V.; Lim, F. Y. (2005-01)
Vertically aligned carbon nanotubes have been grown using Ni as catalyst by plasma enhanced chemical vapor deposition system (PECVD) in various pre-patterned substrates. Ni was thermally evaporated on silicon substrates ...
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The Effect of Periodic Silane Burst on the Properties of GaN on Si (111) Substrates 

Zang, Keyan; Chua, Soo-Jin; Thompson, Carl V. (2005-01)
The periodic silane burst technique was employed during metalorganic chemical vapor deposition of epitaxial GaN on AlN buffer layers grown on Si (111). Periodic silicon delta doping during growth of both the AlN and GaN ...
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Characterization of ZnO Nanorods Grown on GaN Using Aqueous Solution Method 

Quang, Hong Le; Chua, Soo-Jin; Loh, Kian Ping; Chen, Zhen; Thompson, Carl V.; e.a. (2005-01)
Uniformly distributed ZnO nanorods with diameter 70-100 nm and 1-2μm long have been successfully grown at low temperatures on GaN by using the inexpensive aqueous solution method. The formation of the ZnO nanorods and the ...
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Growth of ZnO Nanorods on GaN Using Aqueous Solution Method 

Quang, Hong Le; Chua, Soo-Jin; Loh, Kian Ping; Chen, Zhen; Thompson, Carl V.; e.a. (2005-01)
Uniformly distributed ZnO nanorods with diameter 80-120 nm and 1-2µm long have been successfully grown at low temperatures on GaN by using the inexpensive aqueous solution method. The formation of the ZnO nanorods and ...
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Preliminary Characterisation of Low-Temperature Bonded Copper Interconnects for 3-D Integrated Circuits 

Leong, Hoi Liong; Gan, C.L.; Pey, Kin Leong; Tsang, Chi-fo; Thompson, Carl V.; e.a. (2005-01)
Three dimensional (3-D) integrated circuits can be fabricated by bonding previously processed device layers using metal-metal bonds that also serve as layer-to-layer interconnects. Bonded copper interconnects test structures ...
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The Influence of Adjacent Segment on the Reliability of Cu Dual Damascene Interconnects 

Chang, Choon Wai; Choi, Z.-S.; Thompson, Carl V.; Gan, C.L.; Pey, Kin Leong; e.a. (2005-01)
Three terminal ‘dotted-I’ interconnect structures, with vias at both ends and an additional via in the middle, were tested under various test conditions. Mortalities (failures) were found in right segments with jL value ...

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Thompson, Carl V. (6)
Chua, Soo-Jin (3)Chen, Zhen (2)Fitzgerald, Eugene A. (2)Gan, C.L. (2)Loh, Kian Ping (2)Pey, Kin Leong (2)Quang, Hong Le (2)Chang, Choon Wai (1)Choi, K. W. (1)... View MoreSubjectaqueous solution methods (2)gallium nitride (2)zinc oxide nanorods (2)bonded copper interconnects (1)bonding (1)Carbon nanotubes (1)copper (1)Cu dual damascene processes (1)dotted-I segments (1)fabrication (1)... View MoreDate Issued
2005 (6)
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