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Mortality Dependence of Cu Dual Damascene Interconnects on Adjacent Segments
Electromigration experiments have been carried out on straight interconnects that have single vias at each end, and are divided into two segments by a via in the center ("dotted-I" structures). For dotted-i structures in ...
The Influence of Adjacent Segment on the Reliability of Cu Dual Damascene Interconnects
Three terminal âdotted-I’ interconnect structures, with vias at both ends and an additional via in the middle, were tested under various test conditions. Mortalities (failures) were found in right segments with jL value ...