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Reliability of Multi-Terminal Copper Dual-Damascene Interconnect Trees 

Gan, C.L.; Thompson, Carl V.; Pey, Kin Leong; Choi, Wee Kiong (2003-01)
Electromigration tests on different Cu dual-damascene interconnect tree structures consisting of various numbers of straight via-to-via lines connected at the common middle terminal have been carried out. Like Al-based ...

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Author
Choi, Wee Kiong (1)
Gan, C.L. (1)
Pey, Kin Leong (1)
Thompson, Carl V. (1)
Subjectcopper dual-damascene interconnect trees (1)
dotted-I interconnect trees (1)
electromigration (1)levels of metallization (1)
via-to-via (1)
... View MoreDate Issued2003 (1)Has File(s)Yes (1)

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