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Length Effects on the Reliability of Dual-Damascene Cu Interconnects 

Wei, F.; Hau-Riege, S.P.; Gan, C.L.; Thompson, Carl V.; Clement, J.J.; e.a. (2002-01)
The effects of interconnect length on the reliability of dual-damascene Cu metallization have been investigated. As in Al-based interconnects, the lifetimes of Cu lines increase with decreasing length. However, unlike ...

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Author
Choi, Wee Kiong (1)
Clement, J.J. (1)
Gan, C.L. (1)
Hau-Riege, S.P. (1)
Pey, Kin Leong (1)
Radhakrishnan, M.K. (1)Tay, H.L. (1)Thompson, Carl V. (1)
Wei, F. (1)
Yu, B. (1)Subjectinterconnects (1)length effects (1)
reliability (1)
... View MoreDate Issued2002 (1)Has File(s)Yes (1)

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