Search

Now showing items 1-1 of 1

Length Effects on the Reliability of Dual-Damascene Cu Interconnects

Wei, F.; Hau-Riege, S.P.; Gan, C.L.; Thompson, Carl V.; Clement, J.J.; e.a. (2002-01)

The effects of interconnect length on the reliability of dual-damascene Cu metallization have been investigated. As in Al-based interconnects, the lifetimes of Cu lines increase with decreasing length. However, unlike ...