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Observation of Joule Heating-Assisted Electromigration Failure Mechanisms for Dual Damascene Cu/SiO₂ Interconnects

Chang, Choon Wai; Gan, C.L.; Thompson, Carl V.; Pey, Kin Leong; Choi, Wee Kiong (2003-01)

Failure mechanisms observed in electromigration (EM) stressed dual damascene Cu/SiO₂ interconnects trees were studied and simulated. Failure sites with â€˜melt patch’ or â€˜crater’ are common for test structures in the top ...

Reliability of Multi-Terminal Copper Dual-Damascene Interconnect Trees

Gan, C.L.; Thompson, Carl V.; Pey, Kin Leong; Choi, Wee Kiong (2003-01)

Electromigration tests on different Cu dual-damascene interconnect tree structures consisting of various numbers of straight via-to-via lines connected at the common middle terminal have been carried out. Like Al-based ...