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Observation of Joule Heating-Assisted Electromigration Failure Mechanisms for Dual Damascene Cu/SiO₂ Interconnects 

Chang, Choon Wai; Gan, C.L.; Thompson, Carl V.; Pey, Kin Leong; Choi, Wee Kiong (2003-01)
Failure mechanisms observed in electromigration (EM) stressed dual damascene Cu/SiO₂ interconnects trees were studied and simulated. Failure sites with ‘melt patch’ or ‘crater’ are common for test structures in the top ...
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Reliability of Multi-Terminal Copper Dual-Damascene Interconnect Trees 

Gan, C.L.; Thompson, Carl V.; Pey, Kin Leong; Choi, Wee Kiong (2003-01)
Electromigration tests on different Cu dual-damascene interconnect tree structures consisting of various numbers of straight via-to-via lines connected at the common middle terminal have been carried out. Like Al-based ...

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AuthorChoi, Wee Kiong (2)Gan, C.L. (2)Pey, Kin Leong (2)Thompson, Carl V. (2)Chang, Choon Wai (1)Subject
electromigration (2)
copper dual-damascene interconnect trees (1)dotted-I interconnect trees (1)failure mechanism (1)Joule heating (1)levels of metallization (1)via-to-via (1)... View MoreDate Issued
2003 (2)
Has File(s)Yes (2)

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