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Wafer-Level Thermocompression Bonds
Thermocompression bonding of gold is a promising technique for achieving low temperature, wafer-level bonding without the application of an electric field or complicated pre-bond cleaning procedure. The presence of a ductile ...
A continuum theory of amorphous solids undergoing large deformations, with application to polymeric glasses
This paper summarizes a recently developed continuum theory for the elastic-viscoplastic deformation of amorphous solids such as polymeric and metallic glasses. Introducing an internal-state variable that represents the ...