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Length Effects on the Reliability of Dual-Damascene Cu Interconnects

Wei, F.; Hau-Riege, S.P.; Gan, C.L.; Thompson, Carl V.; Clement, J.J.; e.a. (2002-01)

The effects of interconnect length on the reliability of dual-damascene Cu metallization have been investigated. As in Al-based interconnects, the lifetimes of Cu lines increase with decreasing length. However, unlike ...

Processing, Structure, Properties, and Reliability of Metals for Microsystems

Thompson, Carl V. (2002-01)

Research on the processing, structure, properties and reliability of metal films and metallic microdevice elements is reviewed. Recent research has demonstrated that inelastic deformation mechanisms of metallic films and ...