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Observation of Joule Heating-Assisted Electromigration Failure Mechanisms for Dual Damascene Cu/SiO₂ Interconnects 

Chang, Choon Wai; Gan, C.L.; Thompson, Carl V.; Pey, Kin Leong; Choi, Wee Kiong (2003-01)
Failure mechanisms observed in electromigration (EM) stressed dual damascene Cu/SiO₂ interconnects trees were studied and simulated. Failure sites with ‘melt patch’ or ‘crater’ are common for test structures in the top ...

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Author
Chang, Choon Wai (1)
Choi, Wee Kiong (1)
Gan, C.L. (1)Pey, Kin Leong (1)
Thompson, Carl V. (1)
Subject
electromigration (1)
failure mechanism (1)
Joule heating (1)
... View MoreDate Issued
2003 (1)
Has File(s)
Yes (1)

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