Now showing items 1-4 of 4
Length Effects on the Reliability of Dual-Damascene Cu Interconnects
The effects of interconnect length on the reliability of dual-damascene Cu metallization have been investigated. As in Al-based interconnects, the lifetimes of Cu lines increase with decreasing length. However, unlike ...
Processing, Structure, Properties, and Reliability of Metals for Microsystems
Research on the processing, structure, properties and reliability of metal films and metallic microdevice elements is reviewed. Recent research has demonstrated that inelastic deformation mechanisms of metallic films and ...
Investigation of the Fundamental Reliability Unit for Cu Dual-Damascene Metallization
An investigation has been carried out to determine the fundamental reliability unit of copper dual-damascene metallization. Electromigration experiments have been carried out on straight via-to-via interconnects in the ...
Atomistic Simulations of Metallic Cluster Coalescence
A new computational method is introduced to investigate the stresses developed in the island-coalescence stage of polycrystalline film formation during deposition. The method uses molecular dynamics to examine the behavior ...